品牌 |
包装/箱 |
型号 |
描述 |
数据表. |
库存 |
价钱(USD) |
数量. |
---|---|---|---|---|---|---|---|
675 |
PCB COPPER CLAD POS 12X18 1SIDE |
download |
0.0000 |
|
|||
573 |
PROTO BOARD COPPER CLAD 18X12" |
0.0000 |
|
||||
576 |
PROTO BOARD COPPER CLAD 36X24" |
download |
0.0000 |
|
|||
676 |
PROTO BOARD COPPER CLAD 12X8" |
download |
0.0000 |
|
|||
551 |
PROTO BOARD COPPER CLAD 6" X 6" |
19.2662 |
|
||||
532 |
PCB COPPER CLAD 1/16" 2-SIDE |
0.0000 |
|
||||
689 |
PROTO BOARD COPPER CLAD 9" X 6" |
download |
0.0000 |
|
|||
8329TCM-6ML |
Thermal Interface Products THERM CONDV EPOXY MC 6ml(.20oz) SYRINGES |
download |
180.7938 |
|
|||
860-150G |
HEAT TRANS COMPOUND SILICONE |
download |
182.0814 |
|
|||
8616-85ML |
SUPER THERMAL GREASE |
download |
0.0000 |
|
|||
832TC-450ML |
POTTING COMPOUND BLK THER 450ML |
download |
2267.5828 |
|
|||
8329TFF-25ML |
FAST CURE THERM COND ADH FLOW |
download |
269.3956 |
|
|||
8329TFM-25ML |
MEDIUM CURE THERM COND ADH FLOW |
download |
0.0000 |
|
|||
8617-85ML |
Super Thermal Grease#Zinc Oxide Free;85ML |
download |
0.0000 |
|
|||
8329TFM-50ML |
MEDIUM CURE THERM COND ADH FLOW |
download |
0.0000 |
|
|||
8329TCF-50ML |
FAST CURE EPOXY ADHESIVE |
download |
0.0000 |
|
|||
846-80G |
GREASE CARBON ELEC CONDUCT 2.8OZ |
download |
622.5468 |
|
|||
8329TFF-50ML |
FAST CURE THERM COND ADH FLOW |
download |
401.0808 |
|
|||
8463-7G |
GREASE SILVER CONDUCTIVE 0.25OZ |
download |
0.0000 |
|
|||
8327GF41-50CC |
THERMAL GAP FILL LIQUID SILICONE |
download |
0.0000 |
|
|||
8329TFS-25ML |
SLOW CURE THERM COND ADH FLOW |
download |
276.1717 |
|
|||
8616-25ML |
SUPER THERMAL GREASE |
download |
149.5294 |
|
|||
8329TFS-50ML |
SLOW CURE THERM COND ADH FLOW |
download |
476.0809 |
|
|||
8329TCS-6ML |
ADHESIVE - THERMALLY CONDUCTIVE EPOXY,SLOW CURE |
download |
194.6598 |
|
|||
860-60G |
Heat Transfer Compound;Silicone;whitepaste;2 oz tub |
download |
446.8847 |
|
|||
8327GF25-50CC |
THERMAL GAP FILL LIQUID SILICONE |
download |
0.0000 |
|
|||
8616-3ML |
SUPER THERMAL GREASE |
download |
321.1552 |
|
|||
8329TCM-50ML |
EPOXY |
download |
438.9233 |
|
|||
8329TCM-200ML |
ADHESIVE - THERMALLY CONDUCTIVE EPOXY,MEDIUM CURE |
download |
0.0000 |
|
|||
832TC-2L |
Epoxy Compound;thermally conductive;2part;black; |
download |
1433.8134 |
|
Please send RFQ , we will respond immediately.